[vc_row][vc_column width=”1/2″][vc_column_text]Vias are used to create an:
i) electrical connection between layers
ii) a thermal path for heat flow
iii) ground or power connection
THE MOST COMMON VIAS
Through hole – connecting the upper layer with the lower layer.
Blind – connecting an exposed layer with an inner layer
Buried– connecting inner layers[/vc_column_text][vc_empty_space][/vc_column][vc_column width=”1/2″][vc_column_text]
[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/1″][vc_column_text]The following are some simple tips for designing vias on printed circuit boards which will improve performance, increase the stability of the product and help cost efficiency.
GENERAL TIPS
- Blind & buried vias can increase the cost of your PCB design by up to 12 (thanks to Quick‐teck 2012 PCB cost analysis report)
- Position Ground & Power vias near power supply pins
When Designing High Speed Circuits Be Mindful That:
- Vias can cause signal distortion. Do not add them without serious consideration to this factor.
- Pads on vias create parallel pad capacitance.
- The length and diameter of the via affects the capacitance & inductance.
When Using Thermal Vias Be Aware That:
- Thicker plating on the via reduces thermal resistance.
- Increased pad size helps to improve the thermal spreading.
- Multiple well-spaced small vias can create better thermal transfer.
- During solder reflow vias can fill, unless tented or plugged and this can result in reduced thermal transfer.
Blind & Buried vias have higher thermal resistance.
For more information on vias – and there is lots check out these great reads.
https://blog.lamsimenterprises.com/2011/02/15/pcb-vias-an-overview/
https://www.quick-teck.co.uk/TechArticleDoc/19895134801360697091.pdf[/vc_column_text][/vc_column][/vc_row]
